Microelectromechanical Systems (MEMS)

MEMS technology allows incredibly tiny electro-mechanical devices to be produced. Dozens of such devices are on this 1 sq. cm. chip developed at SwRI.

Institute engineers design and test MEMS actuators that use wafer fabrication technology to achieve miniature moving parts as small as 200 x 50 x 5 µm³ (tens of microns across) that respond to electrical and physical stimuli. These actuators have been used to develop a variety of devices, including an optical cross-connect switch and a miniature mechanical timed relay switch. The optical cross-connect switch is a smaller, less expensive switch, with an increased port count, which can be used in high-speed optical networks. The timed relay switch is the first MEMS device to exert force over a significant distance on an object external to the MEMS actuator. Other MEMS actuators are being used as components of a high current electrical relay and a MEMS Materials Lab on a Chip for determination of material properties and device lifetime studies. A 3D profiling system is being developed to make accurate surface measurements of MEMS structures.

Division facilities suitable for MEMS research include:

• A Class 1000 clean room
   
• Metrology tools
  
  • Optical profilometer

    Staff members design and test MEMS devices using wafer fabrication technology to achieve miniature moving parts that respond to electrical and physical stimuli. Hundreds of MEMS devices can be contained on a 1 cm2 chip.

  • Atomic force microscope
  • Scanning electron microscope

• Operational analysis and packaging
  
  • Probe station
  • Wirebonder and ball bonder
     
• Processing tools
  
  • Laser micromachining
  • Direct write printer
  • Spin coater

Patents include:

• Spectroscopic optical switch (U.S. Patent 6,587,612)
• Bi-directional thermal actuator (U.S. Patent 6,608,714)
   

Joe Mitchell, Senior Research Engineer
 

Electromechanical and Optical Systems Department Applied Physics
SwRI Technical Divisions SwRI Home

July 18, 2008