"Method and Apparatus for High Rate, Uniform Plasma Processing of Three-Dimensional Objects"
Patent No.:	8,252,388
Inventor(s):	Ronghua Wei, Christopher Rincon, Edward Langa
Date of Issue:	8/28/2012
Assignee:	SwRI
Full Text:	US Patent & Trademark Office

Click on the inventor's name to view related technical resources:
Ronghua Wei:	Program Director, Materials Engineering, Mechanical Engineering
Christopher Rincon:	Engineering Technologist, Mechanical Engineering

For further information, contact the Communications Department, Southwest Research Institute.

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