| Destructive physical analysis (DPA) of electronic and electrical components. Laboratory capabilities include optical and scanning-electron microscopy, energy-dispersive x-ray elemental analysis, x-radiography, fine-leak and gross-leak hermeticity testing, particle-impact-noise detection, decapsulation, disassembly, cross
sectioning (both mounted and unmounted), delayering (both wet-chemical and plasma etching), and microprobing. Additional relevant capabilities that exist in other SwRI laboratories include Fourier-transform infrared spectrometry, gas and liquid chromatography, gas chromatography and mass spectrometry, inductively coupled plasma atomic-emission spectrometry, atomic-absorption spectrometry, thermogravimetric analysis, differential scanning calorimetry, x-ray diffraction, and scanning-Auger microprobing. |
