| Failure analysis of electronic and electrical components. Included in the Group's experience are (1) passive components (e.g., resistors, capacitors, inductors, transformers, switches, etc.), (2) electromagnetic devices (e.g., relays, motors, etc.), (3) miscellaneous devices (e.g., transducers, sensors, fuses, lamps, etc.), (4) discrete semiconductor devices (e.g., transistors, diodes, optoelectronic devices, silicon controlled rectifiers, etc.), and (5) low-density integrated circuits (e.g., operational amplifiers, simple logic blocks, voltage regulators, etc.).
Laboratory equipment supports key failure-analysis operations including photography, optical microscopy, x-radiography, package opening, scanning-electron microscopy, elemental analysis by energy-dispersive x-ray spectroscopy, cross sectioning (both mounted and unmounted), microprobing, wet-chemical and plasma etching, hermeticity testing, and particle-impact-noise detectio |
