Abstract:
A system and associated methods for acquiring and analyzing LEIS data from a buried structure, such as a pipeline. A special probe having adjustable electrodes is placed in the soil above the structure. A voltage is applied to the structure, causing more current to emanate from a coating defect than from intact coating. The probe electrodes acquire a response signal, which is analyzed to detect the defect.
Patent Number:
8,310,243
Date Of Issue:
11/12/2012
Inventors:
Pavan K. Shukla; Todd S. Mintz; Biswajit Dasgupta; Jay L. Fisher; Osvaldo Pensado-Rodriguez
Full Text: