Abstract:
Methods of making microcapsules and microcapsules comprising a core material and a shell material with substantially different dielectric constants and dissipation factors. Exposure to appropriate electromagnetic energy selectively (a) heats the core material with the higher dielectric constant and dissipation factor, directly or indirectly fusing the shell material and forming microcapsules, or (b) hardens polymerized shell material, which has a high dielectric constant and dissipation factor.
Patent Number:
6,881,482
Date Of Issue:
04/18/2005
Inventors:
Niraj Vasisht
Full Text: