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Aligned Polymers Including Bonded Substrates

Abstract: 

The present disclosure relates to the present disclosure relates to a method of fabricating an aligned polymer containing a bonded substrate and related compositions. The method involved placing a polymer in solution which is capable of alignment wherein the polymer is also bound to a selected substrate. This may then be followed by placing the polymer solution in an electrochemical cell wherein the polymer solution is in contact with at least one electrode and applying an electric field/voltage to the polymer solution and generating a pH gradient wherein the polymer and bonded substrate positions at the isoelectric point of the polymer in solution.

Patent Number: 
8,557,956
Date Of Issue: 
10/15/2013
Inventors: 

Xingguo Cheng; Vasiliki Z. Poenitzsch