Abstract:
A pseudo-physical model simulates the erosion of large area three-dimensional patterns on workpieces during a chemical mechanical polishing process. The model is based on determining the vertical location of individual nodes on the polishing pad stack and corresponding individual nodes on the workpiece. Contact forces between the pad and the workpiece are determined by the deflection of the pad stack which is transformed into a contact force by modeling the polishing stack as abstract mathematical springs.
Patent Number:
6,889,177
Date Of Issue:
05/02/2005
Inventors:
Scott R. Runnels