Advanced science.  Applied technology.


Thermal Stress Analysis: Balancing Vibration, Thermal Growth, and Flange Loads

Oct 14, 2020
Go to Machinery Webinar event

Free Webinar: Thermal Stress Analysis: Balancing Vibration, Thermal Growth, and Flange Loads

Join us Wednesday, October 14, 2020, at 12:00 p.m.–1:00 p.m. (U.S. Central Time)

Host: Benjamin White

This webinar will discuss the fundamental elements of a thermal stress analysis as well as more advanced topics on implementing various clamp types to reduce compressor flange loads without piping geometry changes. When designing a piping system, conflicting requirements must be met to allow for thermal growth and reduced flange loads while also providing sufficient control of piping dynamic excitation forces to reduce vibrations. Often the results of thermal stress analyses are inaccurate or incomplete resulting in high piping vibration, overstressed flanges, or support structure failures due to poor understanding of modeling techniques, piping codes, support structures, and sources of piping vibration. To successfully design a piping system that allows for sufficient thermal growth with adequate vibration control, a thorough understanding of support types and stiffnesses, piping design basics, mechanical natural frequencies, vibration sources and frequencies, and piping codes is required.

For more information, please contact Dorothea Martinez.